- Quick repairing of oxidized solder balls for chipset without lifting.
- Fast reflow and evenly spread under BGA chipset.
- High quality and activity.
- Not corrosive and easy cleaning.
- Repairing BGA Chipset Solder Balls without lifting.
- Suitable for Wave & Dip Soldering Process.
For Using and Notices:
- Put a little bit of Flux.
- Use only hot air soldering station for SMT ICs rework.
- Use any solvent such as, thinner or any alcohol for cleaning.
- Perform the process in a well-ventilated area.
- Close After Using & Keep Away from Children.
- The flux is a yellow liquid, packaged in a transparent plastic bottle, capacity 50ml.
- 1 X BGA Liquid Flux 50mL.