• Quick repairing of oxidized solder balls for chipset without lifting.
• Fast reflow and evenly spread under BGA chipset.
• High quality and activity.
• Not corrosive and easy cleaning.

Usage:

•   Repairing BGA Chipset Solder Balls without lifting.
•   Suitable for Wave & Dip Soldering Process.

For Using and Notices:

• Put a little bit of Flux.
• Use only hot air soldering station for SMT ICs rework.
• Use any solvent such as, thinner or any alcohol for cleaning.

Safety Precautions:

• Flammable.
• Perform the process in a well-ventilated area.
• Close After Using & Keep Away from Children.

Appearance:

• The flux is a yellow liquid, packaged in a transparent plastic bottle, capacity 50ml.

Package Included

• 1 X BGA Liquid Flux 50mL.