HC-131 Heatsink Thermal Compound Paste
25.00 EGP
The HC-131 Thermal Paste is a premium-grade thermal interface material (TIM) designed to enhance heat dissipation between CPUs, GPUs, LED chips, and other electronic components. With high thermal conductivity and low thermal resistance, this silicone-based compound ensures optimal heat transfer, improving system stability and longevity.
Description
HC-131 Heatsink Thermal Compound Paste
Key Features:
✅ High Thermal Conductivity – Efficiently transfers heat away from critical components (up to X W/m·K).
✅ Low Thermal Resistance – Minimizes temperature gaps for better cooling performance.
✅ Non-Conductive & Non-Corrosive – Safe for use on sensitive electronics (no risk of short circuits).
✅ Smooth Application – Creamy consistency for easy spreading (no curing time required).
✅ Long-Lasting Stability – Resists drying, cracking, or pump-out effect under high temps.
✅ Wide Compatibility – Works with CPUs, GPUs, LED heat sinks, power electronics, and more.
Applications:
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PC Builds & Overclocking – Improve cooling for CPUs and GPUs.
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LED Lighting Systems – Enhance heat dissipation for high-power LEDs.
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Electronics & Industrial Devices – Reliable thermal management for power modules and ICs.
Package Includes:
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1x HC-131 Thermal Compound Syringe (X grams)
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(Optional) Spatula/application tool
Why Choose HC-131?
✔ Better Than Stock Paste – Superior heat transfer compared to pre-applied thermal pads.
✔ Durable Performance – Maintains effectiveness even under prolonged high-temperature use.
✔ Cost-Effective Cooling Solution – Extends hardware lifespan by reducing thermal throttling.
Upgrade your cooling system with HC-131 Thermal Paste—maximize performance and protect your components!
