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  • HC-131 Heatsink Thermal Compound Paste

  • 25.00 EGP
  • The HC-131 Thermal Paste is a premium-grade thermal interface material (TIM) designed to enhance heat dissipation between CPUs, GPUs, LED chips, and other electronic components. With high thermal conductivity and low thermal resistance, this silicone-based compound ensures optimal heat transfer, improving system stability and longevity.
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